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For over 10 years, eComp has taken a leadership role as an Independent Distributor and Solution Provider of Electronic Products providing World Class support in the following areas:
Stage 1:
Component value added Services
Component Sourcing
Component - Testing, DPA / Programming
Part Management / BOM Analysis
Component Engineering
Stage 2:
Semiconductor Die Search
Die attached and Packaging
Module and Hybrid Assembly
Component up-Screening
Stage 3:
Re-Engineering
Design Services
FPGA and ASIC design
And development
Quality Sourcing, Markings Inspection, De-Cap & Die Verification, Electrical Testing to Original Data Sheet Specs, Lead Testing & Coating, Packaging to Individual Needs.
Authorized Distributor for Eltek Semiconductor and Lansdale Semiconductor. Independent source of die for standard and custom packaging. Canvys Custom Displays for Situational Awareness applications.
Custom Solutions for Individual needs. High-End RF/Microwave Hybrids from KCB Solutions or full System Re-Engineering of Drives, Servers, up to entire Backbones through Nemonix. |
 
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| Testing Capabilities |
Products Supported:
Memory
Digital
Linear
Discrete
Relay
Crystal
Passive
RF Devices
High Density products |
Tests Performed:
Temp Cycling (air to air)
Fine and Gross Leak
P.I.N.D (Particle Impact Noise Detection).
Programming
Environmental Testing
Labeling
Burn-In Capabilities
Lead Tinning
Bake and Dry Pack
Destructive Physical analysis (DPA) |
Military Standards
MIL-M-38510
MIL-PRF-38535
MIL-PRF-19500
MIL-STD-202
MIL-STD-750
MIL-STD-883
MIL-STD-981
MIL-HDBK-454
MIL-I- 45208
Mil-PRF-38534 |
Call eComp today and let us help you with Obsolescence Solutions!
Call us at 508-881-8399 or call toll-free 1-877-463-2667 or email us now.
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