eComp - Electronic Components, Inc. Electronic Components Part Search
HomeAbout UsProductsQuote RequestPart SearchContactSurveyTrade Shows

Electronic Component Testing Services

Parts Search

Company Services Profile

Obsolete / Legacy Component Solutions

Obsolete Product Line Card

Franchise Distributor

Manufacturers Line Representative

Component Engineering / BOM Analysis

Military / Industrial Electronic Component Solutions

Contract Manufacturing

Turnkey IC Procured - Programmed Services

Comprehensive Electronic Component Turn-Key Solutions

Engineering Services & Component Testing

Quote Request

Contact Us
News
Links
Site Map
eComp offers electronic component testing services for the aerospace, defense, electronics, medical, automotive and commercial industries from an ISO 9001:2008 certified facility.

Testing Services

Quality Compliance

  • ISO 9001:2008
  • MIL-I-45208

Equivalent Testing To

  • MIL-M-38510
  • MIL-PRF-38535
  • MIL-PRF-19500
  • MIL-STD-202
  • MIL-STD-750
  • MIL-STD-883
  • MIL-STD-981
  • MIL-HDBK-454

Electrical Testing/Burn-In
Extensive test program library with capabilities for AC, DC parametric and functional evaluation and testing of a wide variety of devices ranging from diodes and transistors to more complex linear, LSI, VLSI technologies, as well as complete bench test set-ups for non-standard parameters and passive components. Static/Dynamic Burn-In with positions are available for most package styles.

  • Up Screening - Industrial Temperature
  • Ac Parametrics
  • Burn-In
  • Life Testing
  • Read & Record
  • Go/No-Go
  • Pre & Post Electrical
  • Memory Testing
  • Comparative Analysis

Environmental Testing

  • Solderability/Tinning
  • Stabilization Bake
  • Humidity Testing
  • Temperature Cycle
  • Centrifuge
  • Hermeticity (FINE/GROSS Leak)
  • Particle Impact Noise Detection (PIND)

Custom Services

  • Device Programming & Erasure
  • Marking
  • Bar Coding
  • Dpa/Failure Analysis
  • Selection Testing
  • Engineering Evaluation

Facilities Listing

Tape and Reel & Dry Packaging

  • Tape and Reel - Q-Corp QMT-1100D
  • Counter - Q-Corp QC-100
  • Vacuum Seal - Amerivacs AVS-20
  • Dry Packaging

Memory Testing

  • Darkhorse Systems Sigma II dc parametric performed of DRAM devices
  • Darkhorse Systems Sigma LC functional testing of DRAM

Digital Testing

  • Logue McDonald LMO500 - 384 I/O-100MHz
  • Gen Rad 1732M Test Systems dc and parametric measurements
  • Logue McDonald 324B-5 Test Systems - dc and parametric measurements along w/propagation delays

Linear Testing

  • Analog Devices LTS2020
  • Analog Devices LTS2010 - Parametric and functional testing capabilities for linear device such as
  • Op Amps, Comparators, Regulators, DAC's and ADC's

Discrete Testing

  • Scientific Test 5150 Test Systems with High Voltage and High Current capability
  • Scientific Test 5300 Test Systems with Low Current capability and multiple section DUT scanner deck - ability to record pre and post burn-in measurements - deltas calculated

Relay Testing

  • Markenrich RT160 Relay Tester

Crystal Testing

  • Saunders & Associates 250A Crystal Test System

Passive Testing

  • Gen Rad 1689 RLC Digibridge Test System
  • Gen Rad 1687 BLC Digibridge Test System
  • Gen Rad 1684 Megohmmeter

Programming

  • Digital I/O Unisite Systems - Variety of fixtures for a large assortment of devices
  • Data I/O PSX1000 Parallel Programmer-capabilities to program up to 10 devices at a time
  • BP Micro BP1400/84

UV Erasure

  • UVEProm Erasing Cabinet

Labeling

  • Brady Printer TMT 200M assortment of labels for all types of packages - kapton labels for high temperature applications

Temperature Testing

  • Temptronics TP04000 Series Thermostream -65C to 200C
  • Thermonics T2420SX-7 Temperature Forcing Systems capability of device environment of -65C to 200C
  • Thermonics T-2820 Precision Temperature Forcing System -65C to 200C

Burn-In Capabilities

  • Liner
  • Digital
  • Discrete
  •     Despatch PBC2-16
  •     Blue M
  •     Capability to perform static on a variety of packages from standard diodes to complex BGA. Dynamic performed at customer request

Temperature Cycling Air To Air

  • Blue M WSP 109B3X16 capable of automatic transfer to satisfy MIL-STD-883 Method 1010 and MIL-STD-750 Method 1051

Gross Leak Testing

  • Trio-Tech 481 Test Systems

Particle Impact Noise Detection (PIND)

  • Dunegan/Endevco 4501A capability to satisfy MIL-STD-883 Method 2020 and MIL-STD-750 Method 2052

Call eComp today and let us show you our Electronic Component Testing Services and our Commitment to Quality!
Call us at 508-881-8399 or call toll-free 1-877-463-2667 or email us now.


eComp®
296 Irving St. • Framingham, MA 01702
Toll-Free 1-877-463-2667 • Tel: 508-881-8399 • Fax: 508-861-0113


HomeProductsPart SearchQuote Request
About UsContact UsLine CardOEM Resources
Electronic Component Industry Links

Visit Chipseeker: The OEM's Exclusive Search Engine for Electronic Components.
Chipseeker is a division of eComp - Electronic Components, Inc.

Copyright © 2002-2012 eComp All rights reserved