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 eComp works closely with Eltek Semiconductor to procure and process semiconductor components in wafer, die and packaged form.
Die Supply
High quality semiconductor die for hybrid and chip on board applications.
Eltek is Europe's longest established, franchised die processor. We supply high quality semiconductor die for use in hybrid and chip on board applications. Our traceable, controlled and certified stock of die exceeds nine million units with product from most major semiconductor manufacturers.
Quality levels:
- Commercial
- Military
- Space
Shipping formats:
- Waffle tray / Gel-Pak®
- Tape and Reel / Surftape®
- Sawn wafers
Visual inspection to:
- MIL-STD-883 Method 2010 Cond A or B
- MIL-STD-750 Method 2072 or 2073
Optional lot qualification to:
- MIL-STD 883
- MIL-PRF-38534
- Customer specification
Assembled Products
Cost effective packaging service, for industry-standard and custom configurations.
Eltek provides a complete, medium and low volume hermetic assembly, test and screening capability. We support a wide variety of ceramic packaging and TO cans intended for demanding environments with products ranging from diodes and transistors to microprocessors and memory.
Ceramic packaging styles
- Dual In-Line (DIL)
- Leadless Chip Carrier (LCC)
- J-Leaded Chip Carrier (JLCC)
- Flatpack and Cerquad (CQFP)
- Pin Grid Array (PGA)
- Custom Package configurations
Metal Can
- TO-39
- TO-5
- TO-18
- TO-99
Plastic and other packaging styles
- Available through approved sub-contractors
Test capability
- Discrete components, op-amps, regulators, precision analogue
- ADCs, mixed signal, ASIC, logic and all memory types
- Full range of AC/DC parametric and functional tests
- -65/200 deg.C temperature station
Test and screening
- MIL-STD 883, military and space flows
- Source Control Drawing
- Customer specification
- Manufacturers datasheet
Wafer Contract Processing
Automated wafer probe, saw and die sort. Bare die tape and reel service.
Eltek has a comprehensive range of sub-contract processing services which are capable of handling very high volume and fast turnaround requirements. Our specialist knowledge and equipment provides a cost effective service for all die users.
Wafer Probing
- Ambient to 200 deg.C
- Automatic Electroglas probers
- Actel approved FPGA wafer programming
- Mixed signal, digital, memory,
discretes
Wafer Sawing
- Up to 8 inch / 200mm
- Automatic handling
- Single or part wafer flexibility
Die offload to waffle / chip tray
- Anti-static and conductive
- Die orientation
- Automatic and manual handling
- Gel-Pak®
Bare die tape and reel
- 8mm to 24mm widths
- Die sizes 0.25mm to 10mm
- 7 inch to 13 inch reels
- EIA/IS747
- Surftape® from Tempo Electronics
Visual inspection to:
- MIL-STD-883 Method 2010 Cond A or B
- MIL-STD-750 Method 2072 or 2073
Optional lot qualification to:
- MIL-STD 883
- MIL-PRF-38534
- Customer specification
Call eComp today and let us help you locate
the electronic components you need!
Call us at 508-881-8399 or email us - with our extensive contacts we can find any part from any electronics manufacturer worldwide.
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