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Emulation
 Custom Solutions from Die to Packaging  Manufacturing of Hard-to-Find Electronic Components  Obsolete Parts When alternative parts are not available, DPACI can manufacture hard-to-find replacements using custom packaging, hybridizing existing designs, die recovery, or redesign. Wafer/Die Qualification - DPACI utilizes QML foundries globally to obtain qualified wafers and dice to support customers with non-standard part requirements. Die Recovery - DPACI has a patent pending die recovery process. DPEM/DCEM (De=encapsulate Plastic/Ceramic Encapsulated Module), for successfully retrieving die from plastic or ceramic parts. The DPEM solution can save hundreds of thousands of dollars over reinventing the device and offers extremely rapid turnaround. A DPEM device can meet all the requirements of military and space level specifications in terms of form, fit, function, quality and reliability. DPEM - DPACI can remove die from plastic parts via a patent pending process called DPEM and repackage it into a new ceramic or plastic package and retain its' total integrity. We have on file reliability test data and customer testimonials for the propriety process. Call eComp today and let us help you with Engineered Technologies! Call us at 508-881-8399 or call toll-free 1-877-463-2667 or email us now. |
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