|
|
 High Performance / High Reliability
Semiconductor Component Packaging
Our primary mission is to provide RF semiconductor packaging solutions for the Defense, Semiconductor and Test Equipment industries.
KCB offers a comprehensive suite of capabilities including:
Package Engineering
Product Evaluation and Qualification
Product Manufacturing
Component Management
Program Management
Device Testing/Screening
Facility
KCB is located at: 42 Nagog Park • Acton, MA 01720. Our facility has 4000 sq ft of manufacturing and office space with 2000 sq. ft. dedicated clean room manufacturing. KCB’s manufacturing facility is fully ESD controlled and particle monitoring is in place for clean room status. Program in place to attain AS9100 certification in 2nd half 2007.
Quality System
Currently Quality Manual and Procedures are in place for critical business processes.
Implementing procedures and processes to comply to AS9100
Plan in place for preliminary Audit for Q3 2007 with certification Audit in Q4
Inspection Systems
• ANSI S20.20 ESD program
• Workmanship - Mil-PRF-38534, Mil-PRF-38535
• SPC implementation for Critical Processes - Wire Bond, Yield, On-Time Delivery
Applications/Products
KCB's primary area of focus is in the Microwave and Millimeterwave domain.
Current product categories include:
- Amplifiers : Low Noise, Driver and Power
- Switches:
• SPST through SP4T, discrete or with driver
• DPDT
- Attenuators: Fixed and Variable
- Integrated products including:
• Switched amplifiers
• Switch matrices
Future products include:
- Mixers
- Multi-stage amplifiers
Key Customers
KCB has designed and manufactured products for a wide group of customers including:
Northrup Grumman, Boeing, BAE, Raytheon, Teradyne, Mini-Circuits, Filtronic Signal Solutions
We have also packaged semiconductor die for suppliers including:
Filtronic Compound Semiconductor, Skyworks Solutions, Bookham Technology
Process Capabilities
KCB is capable in meeting a broad set of process needs. Included in this is single chip or multi-chip microelectronic assembly, product test from DC – 40 GHz, as well as environmental testing.
| Our assembly capabilities include: |
| Eutectic/epoxy die bond |
Wedge and ball wire bonding |
| Visual/bond pull inspection |
Pre-seal vacuum bake |
| Hermetic solder seal |
Hermetic seam seal |
| Non-hermetic epoxy seal |
Ink or engrave marking |
| Package lead forming |
Lead solder tinning |
Our electrical test capabilities include:
DC bias testing, RF small/large signal testing, RF s-parameter data, Wafer probe testing
Our process/test capabilities include:
MIL-PRF-38534, MIL-PRF-38535, MIL-STD-883
Component Management
KCB manages the entire component life cycle for our customers.
Sufficient, well qualified staff is in place to administer:
| Documentation |
Industry Obsolescence |
| • Component Drawings |
• Notification |
| • Assembly Processes |
• End of Life |
| • Test Parameters and Procedures |
• Replacement |
KCB is able to draw on the collective experience of the organization to identify form, fit and function compatible replacements for many components nearing end of life status.
Key Suppliers
KCB employs a diverse group of semiconductor manufacturers including:
Skyworks Solutions, TriQuint, Filtronic Compound Semi, Agilent, M/A-COM, Hittite
Our goal is to be autonomous with respect to suppliers so that we can provide the best possible solution based on available semiconductor designs.
We also remain autonomous with package suppliers. Current package suppliers include:
Kyocera, NTK, Adtech Ceramics, Stratedge
Our unaffiliated position provides ultimate flexibility in meeting our customers needs.
Call eComp today: 508-881-8399 for the KCB Solutions solution!
Electronic Component Solutions / Procurement Specialists
|
