eComp - Electronic Components, Inc. Electronic Components Part Search
HomeAbout UsProductsQuote RequestPart SearchContactSurveyTrade Shows

Engineering Services & Electronic Component Testing

Parts Search

Company Services Profile

Obsolete / Legacy Component Solutions

Obsolete Product Line Card

Franchise Distributor

Manufacturers Line Representative

Component Engineering / BOM Analysis

Military / Industrial Electronic Component Solutions

Contract Manufacturing

Turnkey IC Procured - Programmed Services

Comprehensive Electronic Component Turn-Key Solutions

Engineering Services & Component Testing

Quote Request

Contact Us
News
Links
Site Map

Component Engineering Services

Parts Management - Military and Commercial Systems
DMS Planning - BOM Analysis/Risk Assessment
Obsolescence Solutions
Procurement Technical Support
Root Cause Failure Analysis
Active/Passive Device Procurement
Device Upscreening
-Electrical test
-Burn-in-test
-Environmental test
Critical Die Procurement Services
Tin/Lead Issues

Electronic Components Testing

(Group A Testing)

eComp integrates the purchase of your components, electrical testing & solderability with one P.O.!
1. Original manufacturer’s name
2. Purchase order number
3. Part number and revision
4. Test/inspection results, conditions, & parameters
5. Quantity of parts tested
6. Serial numbers (where applicable)
7. Date of test/inspection
8. QA signature and date

The testing shall consist of Group A, subgroup 1,7, and 9 for microcircuits and Group A, subgroup 2 and 4 for discrete semiconductors and a solderability test. No substitutions of part numbers are allowed. The material will be marked in accordance with the applicable procurement document whether it be a Jan or 38510-slash sheet, DESC drawing or Customer controlled drawing.

eComp is partnered with the most reputable, third party ISO9001:2000 Certified testing facilities. With over 100 years experience in the electronics industry, our capabilities include all levels of electronics and environmental testing.
Testing Capabilities
Products Supported:
• Memory
• Digital
• Linear
• Discrete
• Relay
• Crystal
• Passive
• RF Devices
• High Density products
Additional Capabilities
• Temp Cycling (air to air)
• Fine and Gross Leak Testing
• P.I.N.D (Particle Impact Noise Detection)
• Programming
• Environmantal Testing
• Labeling
• UV Erasure
• Burn-In Capabilities
• Lead Tinning
• Bake and Dry Pack
• Destructive Physical Analysis (DPA)
Military Standards
- MIL-M-38510
- MIL-PRF-38535
- MIL-PRF-19500
- MIL-STD-202
- MIL-STD-750
- MIL-STD-883
- MIL-STD-981
- MIL-HDBK-454
- MIL-I- 45208
- Mil-PRF-38535
- Mil-PRF-38534
Call eComp today for
Electronic Component Testing and
Engineering Services
508-881-8399

eComp®
296 Irving St. • Framingham, MA 01702
Toll-Free 1-877-463-2667 • Tel: 508-881-8399 • Fax: 508-861-0113


HomeProductsPart SearchQuote Request
About UsContact UsLine CardOEM Resources
Electronic Component Industry Links

Visit Chipseeker: The OEM's Exclusive Search Engine for Electronic Components.
Chipseeker is a division of eComp - Electronic Components, Inc.

Copyright © 2002-2013 eComp All rights reserved